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SHUTTLE Barebone Sh570R8 - S1200,

Forsiden Datamaskiner Arbeidsstasjoner SHUTTLE Barebone Sh570R8 - S1200,
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)
SHUTTLE Barebone Sh570R8 - S1200, (SH570R8)

SHUTTLE Barebone Sh570R8 - S1200,

Varenr.:
SH570R8
EAN:
0887993003504
  • Formfaktor Mikro-tårn
  • Prosessor Ingen CPU
  • Antall prosessorer 0
  • Diskret grafikk Ikke tilgjengelig
  • HDD 0GB
  • SSD / Flash 0GB
  • Minne 0GB
  • Operativsystem Fri-DOS (operativsystem)
  • Modell Shuttle XPC Cube
  • CTO / BTO Nei
6 044,-
7 555,- inkl. mva
LEASING (ekskl. mva)
6-mnd 
303,-/mnd
12-mnd 
605,-/mnd
Ved Leasing gjelder: Etableringsgebyr 0,-, faktureringsgebyr 0,-/mnd, minimumsordre 0,-. Frakt og mva. kommer i tillegg. Forutsetter kredittgodkjenning. Leasing kan velges som en betalingsmåte når du går til kassen.
Beskrivelse

XPC cube SH570R8


Compact barebone for workstation and server applications

Be able to access power whenever it is needed. This Shuttle Mini PC in cube format addresses professional users with exceptional CPU, RAM, graphics and storage space demands. It is based on the Intel H570 chipset, developed for 10th generation (Comet Lake) and 11th generation (Rocket Lake) Intel Core processors. The small dimensions of only 33.2 × 21.5 × 19.0 cm (TBH) allow for easy use in changing locations, ideal for mobile content productions. The combination of a current high-end processor, up to 128 GB RAM, four hard disks, NVMe SSD, dual gigabit Ethernet and a current dual-slot graphics card results in a small power package unrivalled in this league in terms of performance per cm³.


Features:

  • For Intel processors in the LGA1200 socket (Gen 10/11)
  • TDP up to max. 125 watts
  • Up to 128 GB of DDR4 memory
  • Two M.2 slots (1× M.2-2280, 1× M.2-2230)
  • PCIe-x16-4.0 for dual-slot graphics cards
  • PCIe-x4 for expansion cards
  • Dual-Gigabit Ethernet, WLAN-ready
  • 4× USB 3.2 (10 Gbit), 1× USB 3.2 Type C (5 Gbit), 3× USB 3.2 (5 Gbit), 4× USB 2.0
  • 1× HDMI 2.0b, 2× DisplayPort 1.4
  • 4× SATA with space for 4× 3.5"
  • Remote power-on connection
  • 500 watt power supply unit (80 PLUS Gold)

Specifications:

Chassis
  • Black aluminium chassis
  • Front panel: brushed aluminium
  • Front door for I/O ports (USB and Audio)
  • Kensington Security Slot at the backpanel (also called K-Slot
  • or Kensington lock) as a part of an anti-theft system
  • Dimensions: 33.2 x 21,5 x 19.0 cm (LWH without feet) = 13.6 litre
  • Height with rubber feet: 19.7 cm
  • Weight: 3.5 kg net / 4.5 kg gross
Mainboard / Chipset
  • Mainboard with Shuttle form factor, proprietary design for XPC SH570R6 Plus
  • Chipset/Southbridge: Intel® H570
  • Passive chipset cooling with heat sink
  • The Northbridge is integrated in the processor.
  • Solid Capacitors for sensitive areas provide excellent heat resistance for enhanced system durability
BIOS
  • AMI BIOS, SPI Interface, 16 MB Flash-EEPROM
  • Supports Hardware Monitoring, Watch Dog
  • Supports Power Fail Resume
  • Supports Firmware-TPM (fTPM) v2.0
  • Supports boot up from external USB flash memory
  • Supports Unified Extensible Firmware Interface (UEFI)
Power supply
  • Built-in 500 Watt mini switching power supply
  • AC input voltage: 100~240V, 50~60 Hz
  • 80 PLUS Gold compliant
  • Active PFC circuit (Power Factor Correction)
  • ATX main power connectors: 2x10 and 2x2-pin
  • Graphics power connector: 6-pin and 8-pin
  • Other connectors: 4x SATA, 2x Molex
Operating System
  • This system comes without operating system.
  • It is compatible with Windows 10/11 (64-bit) and Linux (64-bit)
Processor support
  • Processor Socket LGA 1200
  • Supports Intel Core i9 / i7 / i5 / i3, Pentium Gold and Celeron processors
  • Supports the 10th and 11th generation Intel Core processors, code name "Comet Lake-S" and "Rocket Lake-S" in 14++ nm process technology
  • Maximum supported processor power consumption (TDP) = 125 W
  • Up to 10 CPU cores, 20 threads and 20 MB of L3 cache
  • Does not support the unlock-function of Intel K-Series processors.
  • The processor integrates PCI-Express, memory controller and the graphics engine on the same die.
  • However, processors with "F" identifier do not support integrated graphics
    (performance features depending on processor type)
Heat-pipe processor cooling
  • Shuttle I.C.E. (Integrated Cooling Engine)
  • advanced I.C.E. heatpipe technology, linear-controlled 92mm fan
  • SilentX cooling and noise reduction technology with Active Airflow
Memory support
  • 4x 288-pin slot
  • Supports DDR4 memory at 1.2V
  • Supports Dual Channel mode
  • Supports max. 32 GB per DIMM, maximum total size of 128 GB
  • The maximum DDR4 clock frequency depends on the processor type used:
    • Gen. 11 "Rocket Lake" supports DDR4-3200 (PC4-25600U)
    • Gen. 10 "Comet Lake" Core i7/i9 supports DDR4-2933 (PC4-23433U)
    • other Gen. 10 "Comet Lake" support DDR4-2666 (PC4-21300U)
PCIe Expansion Slots
  • 1x PCI-Express x16 v4.0 slot
    (supports PCI-Express v3.0 with Gen. 10 "Comet Lake" processors)
  • 1x PCI-Express x4 v3.0 slot, open-ended
  • Supports dual-slot (double-width) graphics cards (occupies the second PCI-Express slot)
  • The maximum size acceptable for display cards is 280 x 120 x 40 mm.
  • Graphics power connector: 6-pin and 8-pin
Integrated Graphics (optional)
  • The features of the integrated Intel UHD graphics function depend on the processor type used.
  • Certain processor models do not support integrated graphics
  • The PC features three video outputs which support 2160p/60 UHD resolution:
    • 1x HDMI v2.0b (only HDMI v1.4b with Gen. 10 "Comet Lake" Prozessoren)
    • 2x DisplayPort v1.4
  • Supports displays with 4K Ultra HD resolution at 3840 x 2160 (2160p/60)
  • Supports three independent displays with the integrated graphics function
  • Supports more displays in combination with a discrete graphics card
  • Hardware video decoding/encoding
  • DisplayPort and HDMI support multi-channel digital audio over the same cable
Drive bays
  • Storage bays: 4x 3.5" (internal)
  • Using the optional accessory PHD3 two 2.5" drives
  • can be installed into one 3.5" bay.
SATA connectors
  • 4x Serial ATA 6G connector onboard (rev. 3.0, max. 6 Gbit/s)
  • Supports Intel Rapid Storage Technology (RST) with RAID 0/1/5/10, JBOD)
M.2-2280M SSD slot
  • The M.2 2280M slot provides the following interfaces:
    • - PCI-Express Gen. 4.0 X4, supports NVMe
      (supports only PCI-Express Gen 3.0 X4 with Gen. 10 "Comet Lake-S CPU)
    • - SATA v3.0 (max. 6 Gbps)
  • It supports M.2 cards with a width of 22 mm
  • and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
  • Supports M.2 SSDs with SATA or PCI-Express interface
M.2-2230E slot for WLAN cards
  • Interfaces: PCI-Express Gen. 3.0 X1 und USB 2.0
  • Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
  • Supports WLAN extension cards (optional Shuttle accessory: WLN-M)
HD audio
  • Audio Codec: Realtek ALC897, 5.1 channel
  • Three analog audio connectors (3.5 mm) on the backpanel:
  • Line-in (blue), line-out (green) and microphone input (pink)
  • shared with 5.1 channel line-out (front, rear, center/bass)
  • Front panel: microphone input and head phone output (line-out)
Dual Gigabit LAN
  • Dual Gigabit network with two RJ45 ports
    • 1x Intel i210AT - Ethernet Controller with MAC, PHY and PCIe interface
    • 1x Intel i219LM - PHY connected to the MAC of the processor
  • Supports 10 / 100 / 1.000 MBit/s operation
  • Supports WAKE ON LAN (WOL)
  • Supports network boot by Preboot eXecution Environment (PXE)
  • Supports Teaming mode
Front Panel connectors and buttons
  • Microphone input (3.5 mm)
  • Headphones output (3.5 mm)
  • 1x USB 3.2 Gen 1 (5 Gbps), Type C
  • 3x USB 3.2 Gen 1 (5 Gbps), Type A, blue
  • Power button
  • Power indicator (Blue LED)
  • Hard disk drive indicator (Yellow LED)
Back Panel connectors
  • 1x HDMI 2.0b (HDMI 1.4b with Gen. 10 "Comet Lake" processor)
  • 2x DisplayPort 1.4
  • 4x USB 3.2 Gen 2 (10 Gbps), Type A, red
  • 4x USB 2.0 (Type A, black)
  • 2x Gigabit LAN (RJ45)
  • Audio Line-out (3.5 mm)
  • Audio Line-in (3.5 mm)
  • Microphone Input (3.5 mm)
  • 1x 4-pin connector (2.54 mm pitch) supports:
    • external power on button
    • Clear CMOS function
    • +5V DC voltage for external components
  • Optional: Serial RS232 port (Accessory: "H-RS232")
  • 3x perforation for optional WLAN antennas (Accessory: "WLN-M")
Other connectors
  • Occupied front panel connectors for USB, audio, buttons, LEDs
  • 1x RS232 serial interface (2x5 pin header)
  • 2x fan connectors (4-pin header)
  • 1x USB 2.0 (4-pin header)
Included Accessories
  • Multi-language XPC Installation Guide (EN, DE, FR, ES, JP, KR, SC, TC)
  • Windows 64-bit driver disk
  • 2x Serial ATA cables
  • AC Power Cord (with protective-earth contacts)
  • Heatsink Compound
  • Protector cap for the CPU socket (do not use if heatpipe or fan is mounted)
  • Bag with screws
Optional Accessories
  • Back panel adapter for serial RS232 port (H-RS232)
  • WLAN IEEE 802.11ac/BT4.2 kit with two external antennas (WLN-M)
  • Adapter for 2.5" drives such as SSDs (PHD3)
  • Adapter cable for external power button (CXP01) Environmental criteria
  • Permissible ambient temperature during operation: 0~40 °C
  • Relative humidity: 10~90 %.
Certifications / Compliance:
  • EMI: FCC, CE, BSMI, C-Tick
  • Safety: ETL, CB, BSMI
  • Other: RoHS, Energy Star 5.0, ErP
  • This device is classed as a technical information equipment (ITE) in class B and is intended for use in living room and office. The CE-mark approves the conformity by the EU directives:
    • (1) 2014/30/EU relating to electromagnetic compatibility (EMC),
    • (2) 2014/35/EU relating to Electrical Equipment designed for use within certain voltage limits (LVD),
    • (3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP).

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